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Engineer III - Microelectronic Assembly and Integration

Malibu, CA, USA Req #31
Monday, July 15, 2019
EDUCATION DESIRED: Bachelor’s Degree in Electrical Engineering, Mechanical Engineering, Physics, or related scientific discipline with minimum 5 years of related experience
 

ESSENTIAL JOB FUNCTIONS: Work with engineering and research staff to develop complex customized microelectronic assemblies for mixed signal and high speed analog (e.g. millimeter wave) applications. Perform assembly and integration tasks such as fine pitch multi-tier wirebonding (wedge and ball), flip-attach of chips onto interposers or package substrates, 3D stacking of die and wafers, hand soldering and automated soldering of components onto printed circuit boards (PCBs). Assist the team in design for assembly / manufacturability and other related design and analysis prior to design release. Develop and modify assembly and integration procedures as needed for each new project. Perform intermediate testing (e.g. DC continuity checks) throughout the course of assembly to validate sub-assemblies. Work closely with other domain experts performing related functional design and analyses (e.g. circuit design, signal integrity / power integrity analysis, PCB design, etc.). Maintain awareness of state-of-the-art assembly methods, and develop new or modified methods as needed to support emerging needs. Present details of work to colleagues during project meetings. Create and manage work plans to meet or exceed schedule deadlines. Provide written and oral summaries of work performed as needed for reports.
 

EXPERIENCE DESIRED: Significant experience with high performance microelectronic assembly (described above) required, including hands-on experience with tools mentioned above. Desire experience with testing of complex microelectronic assemblies, particularly as needed to support assembly and integration. Familiarity with more complex electronic testing (e.g. VNA, TDR/TDR, high speed oscillioscopes, etc.) and related design skills (e.g. PCB design, 3D CAD design tools (e.g. Solidworks), thermal analysis, and mechanical analysis would be a plus.
 

KNOWLEDGE DESIRED: Familiarity with theory of operation and materials science related to above microelectronic assembly procedures. Knowledge of fundamental electrical engineering and circuit design principles. Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
 

ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
 

SPECIAL REQUIREMENTS (e.g. driver’s license special tools or restrictions): U.S. citizenship is required. Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
 

This position must meet Export Control compliance requirements, therefore a "U.S. Person" as defined by 22 C.F.R. § 120.15 is required. "U.S. Person" includes U.S. Citizen, lawful permanent resident, refugee, or asylee.
 
We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.

Other details

  • Pay Type Salary
  • Malibu, CA, USA