Engineer IV - Heterogeneous Integration / Microelectronics Packaging
Located in Malibu, California, HRL has been on the leading edge of technology, conducting pioneering research and advancing the state of the art.
EDUCATION DESIRED: Ph.D. in Electrical, Materials, Physics, or Mechanical Engineering or M.S. with 5+ years of relevant experience.
ESSENTIAL JOB FUNCTIONS: Join a team of scientists and engineers to develop next-generation microelectronics packaging technologies for RF, E/O and IR subsystems. R&D position focused on developing technologies for co-integration of microelectronic components from diverse technologies (e.g., CMOS, SOI, III-V,…) into advanced multi-chip modules (e.g., silicon interposer assembly, flip chip, 2.5D and 3D die stacking).
The research staff member will support and eventually lead all aspects of 2.5D and 3D integration technology development, test and evaluation. This potentially includes initial design concept, thermal, mechanical, and electrical analysis and optimization, cleanroom process development, manufacturing feasibility on die, substrate and assembly.
Additional job functions involve publishing papers, writing invention disclosures, attending scientific meetings, interacting with customers, preparing reports and briefings, participating in new concept development and contributing to proposal and technical marketing efforts required to sustain continued R&D efforts.
EXPERIENCE DESIRED: PhD related to 2.5D and 3D microelectronic packaging, multi-chip module and heterogeneous integration for RF/mm-Wave, Photonics, or IR. Hands-on nano/microelectronics semiconductor fabrication (DRIE, RIE, wafer bonder, die attach, lithography, ALD, PECVD, plating, CMP etc). Experience with thermal, mechanical and electromagnetic software. Candidates should possess a proven track record of developing novel and successful solutions to complex technical issues.
KNOWLEDGE DESIRED: Familiarity with heterogeneous integration fabrication processes. Knowledge of multi-physics simulation tools (ANSYS, COMSOL) and 3D CAD mechanical drawing environment. Working knowledge of microelectronic packaging test equipment.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, verbal and written communication, interaction with customers/colleagues and willingness to work in a fast-paced, deadline-driven environment. Must be willing to travel and ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity. Must be able to work within a class 10 Cleanroom. Must be able to work safely with and around potentially toxic and hazardous materials, chemicals and gases.
SPECIAL REQUIREMENTS (e.g. driver’s license special tools or restrictions): U.S. citizenship required. Ability to obtain and maintain security clearance a plus.
HRL offers a very competitive compensation and benefits package. Our benefits include medical, dental, vision, life insurance, 401K match, gym facilities, PTO, growth potential, and an exciting and challenging work environment.
HRL Laboratories is an Equal Employment Opportunity employer and does not discriminate in recruiting, hiring, training or promoting, on the basis of race, ethnicity, color, creed, religion, sex, sexual orientation, gender, gender identity, genetic information, national origin, physical or mental disability, pregnancy, medical condition, U.S. military or protected veteran status, union membership, or political affiliation. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
- Pay Type Salary
- Malibu, CA, USA