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Technical Program Manager – Advanced Packaging and Subsystem Integration

Malibu, CA, USA Req #82
Saturday, February 8, 2020

Located in Malibu, California, HRL has been on the leading edge of technology, conducting pioneering research and advancing the state of the art.

EDUCATION DESIRED: Minimum bachelor’s degree in Systems Engineering, Electrical Engineering, Optical Engineering, Physics, or related discipline. Advanced degree is preferred.

ESSENTIAL JOB FUNCTIONS: Manage and lead several diverse technical teams in successfully executing government and commercial programs from capture to completion. Primarily responsible for meeting cost, schedule and performance metrics in addition to solving customer problems, briefing customers, and participating in proposal and marketing activities. Directs teams in the establishment of plans and milestones and monitors adherence to them. Identifies risks and problems and proactively finds solutions with hands-on attitude. Interacts with the finance, contracts, purchasing, legal and export departments in all issues regarding program performance. Interfaces with customers; organizes and facilitates key meetings. Guides the work of Principal Investigators and supporting staff assigned to programs including establishing goals and budgets, producing reports, and planning for future growth. The candidate will report to the Department Manager and senior leadership on each program’s status, advances, challenges and progress toward milestones.

EXPERIENCE DESIRED: 5+ years in program and project management of government contracts ($2M to $10M+) is required. Experience leading multidisciplinary teams and interfacing with government customers is essential. Past experience managing advanced packaging and subsystem integration for communication, EW, radar, lidar, integrated photonic, and/or imaging systems programs is preferred. Experience with semiconductor micro/nanofabrication, 2.5D and 3D microelectronic packaging, heterogeneous integration, fine scale assembly and multi-chip module. Experience in thermal, mechanical, electrical and environmental modeling & characterization desired.

KNOWLEDGE DESIRED: Knowledge of semiconductor micro/nanofabrication, 2.5D and 3D microelectronic packaging and heterogeneous integration, fine scale assembly and multi-chip module are required. Knowledge of multi-physics simulation tools (ANSYS, COMSOL), high frequency RF/mmW and electromagnetic simulation tools (ADS, MWO, CADENCE, HFSS) and 3D CAD mechanical drawing environment desired. Knowledge of system engineering as well as program and project management processes and tools is required. Knowledge of the government acquisition process is essential.

ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Strong analytical and multi-tasking abilities with excellent written and verbal communication skills. Proficiency with Microsoft Project, Word, Excel, and PowerPoint is required.

SPECIAL REQUIREMENTS (e.g. driver’s license, special tools or restrictions): U.S. citizenship is required. Security clearance or ability to obtain a security clearance is required.

This position must meet Export Control compliance requirements, therefore a "U.S. Person" as defined by 22 C.F.R. § 120.15 is required. "U.S. Person" includes U.S. Citizen, lawful permanent resident, refugee, or asylee.
We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.

Other details

  • Pay Type Salary
  • Malibu, CA, USA